Kioxia Corporation and Western Digital Corp. announced their new joint venture with construction of the first phase of Y7 completed that will enable initial production output beginning in the fall of this year.
Kioxia and Western Digital have developed their sixth-generation, 162-layer 3D flash memory technology. The new 3D flash memory features advanced architecture beyond conventional eight-stagger memory hole array and achieves up to 10 percent greater lateral cell array density compared to the fifth-generation technology.
Western Digital announced that Martin Fink, the executive vice president and chief technology officer, will be transitioning to retirement and moving to an advisory role, where he will continue to report to the chief executive officer, Steve Milligan
Western Digital announced the successful development of its second-generation, four-bits-per-cell architecture for 3D NAND. Implemented for the company’s 96-layer BiCS4 device, the QLC technology delivers the industry’s highest 3D NAND storage capacity of 1.33 terabits (Tb) in a single chip.
